91-22-25669144

Kohesi Bond

welcome to Kohesi Bond



CONTACT US

Contact Person: Utsav Shah

Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com

Mumbai , Maharashtra , India - 400 078

Phone:91-22-25669144

Mobile:2225669144

Email: info@kohesibond.com



OUR PRODUCTS

Miscellaneous

Epoxy Adhesive sealants, coatings, potting and encapsulation compounds. Sodium Silicate coating for EMI - RFI Shielding


KB 1427 HT

Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150C for curing, it can achieve faster cures at elevated temperatures. KB 1427 HT offers an extremely wide serviceable temperature range of -60C to +340C, with a roaring glass transition temperature (Tg) of 220C 230C. This products exquisite flow properties and unlikely low exotherm makes it ideal for use in casting well beyond 1/2 inch thicknesses. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides first-rate mechanical strength properties and dimensional stability. In addition to superior electrical insulation, KB 1427 HT also offers astounding chemical resistance to a variety of fuels, oils and water even at higher temperatures. It has a tan color. It is highly recommended to post cure the epoxy at 180C for 2 12 hours in order to achieve optimum properties. Owing to its magnificent performance and ease of use, KB 1427 HT is ideal for use in aerospace, oil and chemical processing, electronics and various OEM applications. PRODUCT HIGHLIGHTS Serviceable up to 340C Admirable chemical resistance Excellent flow properties Low exotherm upon curing Superior electrical insulation Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Coating, Sealing, Casting Learn more : http://www.kohesibond.com/product/kb-1427-ht/


KB-SS-SIL

Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This products offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI). Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. Shielding effectiveness is measured by attenuation, which refers to the difference in an electromagnetic signals intensity before and after shielding. The unit of measurement is in decibels (dB). Achieving shielding at higher frequencies is extremely challenging. From 1-2 GHz, KB-SS-SILs effectiveness is in the range of 95-105 dBs, similar to an aluminum reference. This rating slowly declines to 95-78 dBs at 2-15GHz and further down to 60 dBs at 18 GHz, at which point it stabilizes. It should be noted that the decibel range of attenuation falls along a logarithmic scale. A 10 dB difference in attenuation indicates a 10 times change in shielding effectiveness. KB-SS-SIL has a wide serviceable temperature range of -30C to +370C. It is a water based system, making it relatively non-toxic. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80C for 1-2 hours. KB-SS-SIL is widely used in electronics and aerospace applications owing to its shielding properties. PRODUCT HIGHLIGHTS Unrivaled electrical conductivity Adheres well to various substrates Superb shielding effectiveness Resists more than 370C Effective moisture barrier Ease of application TYPICAL APPLICATIONS Coating Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-ss-sil/


KB-SS-SCN

Kohesi Bond KB-SS-SCN is a silver coated nickel filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers very high levels of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI), along with cost effectiveness. Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. Shielding effectiveness is measured by attenuation, which refers to the difference in an electromagnetic signals intensity before and after shielding. The unit of measurement is in decibels (dB). Achieving shielding at higher frequencies is extremely challenging. From 1-2 GHz, KB-SS-SCNs effectiveness is in the range of 75-42 dBs, similar to an aluminum reference. This rating slowly declines to 56-42 dBs at 2-15GHz and further down to 50 dBs at 18 GHz, at which point it stabilizes. It should be noted that the decibel range of attenuation falls along a logarithmic scale. A 10 dB difference in attenuation indicates a 10 times change in shielding effectiveness. KB-SS-SCN has a wide serviceable temperature range of -18C to +370C. It is a water based system, making it relatively non-toxic. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80C for 1-2 hours. PRODUCT HIGHLIGHTS Unrivaled electrical conductivity Offers cost effectiveness Very good shielding effectiveness Resists more than 370C Effective moisture barrier Ease of application TYPICAL APPLICATIONS Coating Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-ss-scn/






KB-SS-G

Kohesi Bond KB-SS-G is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI), along with cost effectiveness. Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. Shielding effectiveness is measured by attenuation, which refers to the difference in an electromagnetic signals intensity before and after shielding. The unit of measurement is in decibels (dB). Achieving shielding at higher frequencies is extremely challenging. From 1-2 GHz, KB-SS-Gs effectiveness is in the range of 35-50 dBs. This rating slowly declines to 45-35 dBs at 2-15GHz and further down to 45 dBs at 18 GHz, at which point it stabilizes. It should be noted that the decibel range of attenuation falls along a logarithmic scale. A 10 dB difference in attenuation indicates a 10 times change in shielding effectiveness. KB-SS-G has a wide serviceable temperature range of -18C to +370C. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80C for 1-2 hours. PRODUCT HIGHLIGHTS Superb electrical conductivity Very cost effective Good shielding effectiveness Resists more than 370C Effective moisture barrier Ease of application TYPICAL APPLICATIONS Coating Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-ss-g/


TUF 1621 AOHT

Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C 90C for 3 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70C to +200C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength (> 3,300 psi). TUF 1621 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part A and Part B are off-white in color. TUF 1621 AOHT is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. PRODUCT HIGHLIGHTS Superior thermal conductivity Excellent toughness Convenient 1:1 mix ratio First-rate thermal conductivity Exceptional electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Coating Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595) Learn more : http://www.kohesibond.com/product/tuf-1621-aoht/


TUF 1452 HT-2

Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C 90C for 3 5 hours. TUF 1452 HT-2 is a toughened system, offering low exotherm and a long working life. It can withstand multiple cycles of thermal and mechanical shocks. It offers an extensive serviceable temperature range of -60C to +220C. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is suitable for medium sized castings. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. Part A has a tan-brown color and Part B has an amber color. TUF 1452 HT-2 is widely used in the electronics, aerospace and various OEM applications. PRODUCT HIGHLIGHTS High glass transition temperature Resists thermal and mechanical shocks Very good flow properties Superior chemical resistance Exceptional electrical insulation properties Phenomenal toughness TYPICAL APPLICATIONS Bonding Sealing Coating Potting Encapsulation Packaging : Cans, Pails, Gun Applicator and Syringes Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/tuf-1452-ht-2/


KB 1689

Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C 90C for 3 5 hours. KB 1689 can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15C) to +135C. It is an outstanding adhesive that offers superb bond strength, peel strength and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1689 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.8 2.3 W/m/K), it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a gray color. Owing to its versatile performance, KB 1689 is widely used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications. PRODUCT HIGHLIGHTS Easy mix ratio of 1:1 by weight Outstanding toughness Superior thermal conductivity Cost effective Very low volume resistivity (< 0.005 ohm-cm) Cryogenically serviceable TYPICAL APPLICATIONS Bonding Sealing Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-1689/


KB 1686 M

Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C 90C for 3 5 hours. KB 1686 M offers a volume resistivity of 5 10 ohm-cm. It is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive serviceable temperature range of -50C to +120C. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 1.4 W/m/K), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE). Owing to its versatile performance, KB 1686 M is widely used in electronics, aerospace, electrical, semiconductor, microwave and many OEM applications. PRODUCT HIGHLIGHTS Easy mix ratio of 1:1 by weight or volume Outstanding dimensional stability Superior thermal conductivity High lap shear strength (> 2 100 psi) Nickel filled electrically conductive 100% solids system TYPICAL APPLICATIONS Bonding Sealing Coating Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-1686-m/


KB 1631 HTC-1

Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C 90C for 3 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15C) to +200C. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications. PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Thixotropic Paste Superior dimensional stability Exceptional electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Packaging : Pails and Cans Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595) Learn more : http://www.kohesibond.com/product/kb-1631-htc-1/




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